The thin-quad-flat-pack package (TQFP) is a leaded, thin SMT package commonly used for microcontrollers. Typically 1mm thick. The terminals may be through-hole type in needle shape (like PGA (Pin Grid Array), OPGA (Organic pin-grid array), FCPGA (Flip-chip pin-grid array), PAC (Pin array cartridge), CPGA (Ceramic pin-grid array), SPGA (Staggered Pin Grid Array), CGA (Column Grid Array), CCGA (Ceramic Column Grid Array)), surface-mount type with solder ball leads (like BGA (Ball Grid Array), EBGA (Enhanced BGA), eWLB (Embedded wafer level ball grid array), FTBGA (Flex Tape BGA), TFBGA (Thin & Fine-Pitch Ball Grid Array), FBGA (Fine-pitch ball-grid array), LBGA/LFBGA (Low-profile ball-grid array), TEPBGA (Thermally-enhanced plastic ball-grid array), CBGA (Ceramic ball-grid array), OBGA (Organic ball-grid array), TFBGA (Thin fine-pitch ball-grid array), PBGA (Plastic ball-grid array), MAP-BGA (Mold array process ball-grid array), UBGA (Micro ball-grid array), TBGA (Thin ball-grid array), SBGA (Super ball-grid array), and UFBGA (Ultra-fine ball-grid array)) or leadless surface-mount having electrode pads (like LGA (Land Grid Array)). J. All IC packages fall into two broad categories by mounting style through-hole (PTH) and surface-mount (SMT). One of them is the bonding diagram that shows the connectivity between the die and the package pads. A package related to QFP is plastic leaded chip carrier (PLCC) which is similar but has pins with larger pitch, 1.27mm (or 1/20inch), curved up underneath a thicker body to simplify socketing (soldering is also possible). TQFP vs LQFP: What is the Difference Between Packages When it comes to QFP, you will see a lot of Low profile Quad Flat Packages (LQFP) and Thin Quad Flat Packages (TQFP). packages - TQFP vs QFP landpattern - Electrical Engineering Stack Exchange Lead pitches available for low profile quad flat pack package are 0.4mm, 0.5mm, 0.65mm, and 0.80mm. These QFNs are composed of three sections, namely: These QFNs are pretty pricey compared to other QFNs due to their construction. The LQFP comes in different body sizes, with lead counts ranging from 48 to 216. In additional to the PCB design guidelines in datasheet, which gives general design rule information for PCB design. The electronics industry has standardized package shapes and sizes (the leading standardisation body is JEDEC). This is helpful and easy to understand the article for the beginners! Like how the connections are organized in an IC, how they are laid out using a standard IC package must be coherent with the application and various use cases of the respective IC. They define pin spacing and et cetera in terms of imperial dimensions rather than metric dimensions. Splaying IC pins out in all four directions gets you something that might look like a quad flat package (QFP). a LQFP-EP 64), or they have an odd number of leads, (e.g. Youtube channel :Taking wierd stuff apart. Heat sink quad flat package, heatsink very thin quad flat-pack no-leads (HVQFN) is a package with no component leads extending from the IC. What is the difference between VQFP, HVQFP, TQFP & PQFP? Logged. For example, if you utilize too much paste or voiding, this will significantly affect the stencil design. Later on we shall then compare and contrast them to see if there lie significant differences between the two. On this Wikipedia the language links are at the top of the page across from the article title. Circuit Board Fabrication and PCB Assembly Turnkey Services WellPCB - Circuit Board Fabrication and PCB Assembly Turnkey Services, 3rd Floor, Nanhai Plaza, NO. Since then, there have been several updates to the Directive, the major ones being 2011/65/EU on 8 June 2011 that recasted exemptions expiring in 2011 to future dates (most in 2016). Portions that get heated up faster become lighter, and those that get heated up much later are the ones that have more copper on them. One side for pin pitch size 0.8mm can be used to convert QFP32, TQFP32, LQFP32, or FQFP32 to DIP32 2.54mm. Low profi le Quad Flat Package VQFP. Typical Ceramic QFP body thickness varies from 1.27 mm to 4 mm. Tools & Software. These IC packages have a smaller pitch (50 mils) and were designed for US military standardized PCBs. There are often subtle variations in package details from manufacturer to manufacturer, and even though standard designations are used, designers need to confirm dimensions when laying out printed circuit boards. This makes it easier to mount than TQFP. Low-profile quad flat-package : 1.4 mm high, varying sized and pins on all four sides; Plastic quad flat-pack , a square with pins on all four sides, 44 or more pins; Ceramic quad flat-pack : similar to PQFP; Metric quad flat-pack : a QFP package with metric pin distribution; Thin quad flat-pack , a thinner version of LQFP When working with a PCB design or editing software, you may notice that both the LQFP and TQFP have the same footprint. Variation of TAB, where a chip is mounted directly to a piece of glass - typically an LCD. The pinout can be linear, in two parallel directions, all four sides, or matrix form. QFP The leads on this package extend out from four sides of the package; the leads are either gullwing (L-shaped) or straight. Regular QFP are 2.0 to 3.8mm thick depending on size. 1. Rectangular the number of pins that come out of each side is different due to varying lengths. Package Type Pin Count jc ja Still Air Units 1.0 m/s 200 ft/min 2.5 m/s 500 ft/min 1. qjc for CQFP and CCLG packages refers to the thermal resistance between the junction and the bottom of the package. Free e-zine with select content and advertisements of Electronics For You. The quad flat package (QFP) is basically an integrated circuit package which is surface-mounted and pins on them are spaced anywhere from .4mm-1mm apart. This package requires a carefully designed PCB concerning electromagnetic compatibility. SMT has almost overtaken the through-hole packaging. The solder printing process includes uniformly spreading the solder paste onto the PCB. Quad Flat Package. Instead of a tree-structured classification generally used by suppliers and manufacturers, we are listing the major IC package types. The common flat pack IC packages are QFP (Quad Flat Package), TQFP (Thin Quad Flat Package), STQFP (Small Thin Quad Plastic Flat Package), FQFP (Fine-pitch Quad Flat Package), HQFP (Quad Flat Package with Heat sink), LQFP (Low profile Quad Flat Package), VQFP (Very-small Quad Flat Package), MQFP (Metric Quad Flat Package), BQFP (Bumper quad flat-pack), ETQFP (Exposed thin quad flat-package), PQFN (Power quad flat-pack), PQFP (Plastic quad flat-package), QFJ (Quad Flat J-leaded package), QFN (Quad Flat Non-leaded package), TQFN (Thin-Quad Flat No-Lead Plastic package), DFN (Dual Flat package), QFI (Quad Flat I-leaded package), HVQFN (Heat-sink very-thin quad flat-pack, no-leads), VQFN (Very-thin quad flat, no-lead), WQFN (Very-very-thin quad flat, no-lead), UQFN (Ultra-thin quad flat-pack, no-lead), and ODFN (Optical dual flat, no-lead). Ultimately, the distinctions between these two packages are so subtle that it barely makes a difference which one you choose. Wettable Flanks QFNs have an elevation reflecting solder wetting. Also, you require an applicable PCB footprint and a stencil design to assemble this component appropriately. The single row configuration QFN packages are formed using the following processes: Both of these procedures split up an extensive package collection into solitary packages. Quad-flat no-leads (QFN) Laser Direct Imaging (LDI) in PCB Manufacturing, All about Active, Passive and Electromechanical Components, Terminology of Electronic Components in PCB Assembly. PQFP(Plastic/Power Quad Flat Pack) Wiki - FPGAkey LQFP (Low Profile Quad Flat Package) LQFP is a kind of QFP whose package body thickness is 1.4 mm and this is the name used by the Japanese Electronics and Machinery Industry according to the new QFP shape specification. Hexavalent Chromium (Cr6+): 0.1% (1000ppm), 4. In flip chip systems the IC is connected by solder bumps to a substrate. Due to the large body size of CQFP packages, parasitics are important for this package. PQFP. quad-flat no-leads The common dual-inline packages are DIP (Dual In-line Package), SDIP (Shrink Dual In-line), CDIP (Ceramic Dual In-line), CER-DIP (Glass-sealed Ceramic DIP), PDIP (Plastic DIP), SKDIP (Skinny DIP), WDIP (Dual In-line with Window Package), and MDIP (Molded DIP). It also makes these packages pretty reliable when it comes to packaging the central processing unit (CPU). One major QFP issue is how easily the lead pins get damaged or bent. The portfolio covers from 16 Kbytes to 1 Mbyte of Flash with motor control peripherals, USB full-speed interface and CAN. The dimensions of the terminals also serve as a distinguishing factor in similar package types. These packages are manufactured using plastic. Soldering QFNs is pretty crucial in the assembly activity. The common surface-mount leadless packages are LCC (Leadless Chip Carrier), PLCC (Plastic Leaded Chip Carrier), and PQFP (Plastic Quad Flat Pack). Dual in-line packages are handy to use on breadboards and prototyping boards. However, the TQFP has shorter leads than the LQFP. The reason is that the finely etched or stamped lead frame allows the QFP to contain more leads and have a smaller profile to achieve better electrical characteristics . QFP technology smoothens IC operations. QFP Component Package | mbedded.ninja Quad flat No-lead packages and Quad flat packages are both pretty impressive devices. Flip-chip is less expensive molded QFN package that utilizes flip-chip interconnectivity onto copper lead frame. Pages: [ 1] Go Up. The Low Profile Quad Flat Pack, or LQFP, is a surface-mount IC package with leads extending from all four sides of the package body. Comprehensive Analysis of IC Packaging Packages Types How Intuit democratizes AI development across teams through reusability. LQFP - Low-profile Quad Flat Pack. Another dimensional change suffered by this package is board flexure. These are the following . Other special variants include low profile QFP . Normal QFPs, on the other hand, utilize imperial measurements. Find all TI packages | Texas Instruments My datasheet says TQFP but has no recommended land pattern. Nevertheless, we can use both packages in similar applications as they are both low-profile packages. 49.00 (inc GST) 41.53 (+18% GST extra) Purchase this product now and earn 1 Robu Point! Note that excessive soldering paste causes solder bridging. PPM = (mass of substance / mass of material) * 1,000,000 * total amount of each RoHS substance contained in the material. Even though QFNs are pretty awesome, they bear some snags, which include: If you are a PCB designer, then you probably know that QFN manufacturability is a crucial factor to consider. 45. Types of IC packagesChip One Stop - Einkaufsstandort fr We hope this article has shed light upon any questions you might have had regarding QFPs and QFNs and their differences. May vary by manufacturer, but T usually means Thin, so lower profile package. The common surface-mount small-outline packages are SOP (Small Outline Package), CSOP (Ceramic small-outline package), DSOP (Dual small-outline package), HSOP (Thermally-enhanced small-outline package), SSOP (Shrink Small Outline Package), TSOP (Thin-Small Outline Package), TSSOP (Thin-Shrink Small Outline Package), TVSOP (Thin very-small-outline package), MSOP (Mini/Micro Small Outline Package), HSSOP (Thermally-enhanced shrink small-outline package), HTSSOP (Thermally-enhanced thin shrink small-outline package), QSOP (Quarter Small Outline Package), SOIC (Small Outline Integrated Circuit), mini-SOIC (Mini small-outline integrated circuit), SOICW (Small Outline Integrated Circuit Wide), PSOP (Plastic small-outline package), PSON (Plastic small-outline no-lead package), VSOP (Very-small-outline package), VSSOP (Very-thin shrink small-outline package), SOJ (Small Outline J-leaded package), SON (Small Outline Non-leaded package), VSON (Very-thin Small Outline Non-leaded package), WSON (Very-very-thin small-outline no-lead package), and USON (Very-very-thin small-outline no-lead package). What is QFP (Quad Flat Package)? - Electrical Information SSOP : 0.65mm/0.80mm/ 1.00mm LQFP : 0.40mm/0.50mm This IC has two parallel rows of pins extending perpendicularly out of a rectangular plastic housing. Lead (Pb): 0.1% (1000ppm), 2. To accomplish this you must replace a couple of pins, often those found in the central part of the opposing side, with pins that are thicker. Why does this happen? For example, the following is a screenshot of the package line-up from Fujitsu. I made PCBs for HT1632c chips, but they retiring QFP package and switching to LQFP. E.g. Next, you have to de-solder (keep the temperature profile of your component and the board in mind). Solder these replacement pins onto a larger pad on the print circuit board with a large copper area. The leadless types have electrode pads as the terminals for the connections. Ceramic QFP packages come in two variants, CERQUAD and CQFP: Hereby the leadframe is attached between two ceramic layers of the package. However, you can get one package molded up using this method due to this construction procedure. QFP (Quad Flat Package) is a gull-wing (L-shaped) package with leads coming out of four sides of the package. Other types are proprietary designations that may be made by only one or two manufacturers. MathJax reference. PTH was introduced to work with printed circuit boards having tracks on both sides and inner layers. Making statements based on opinion; back them up with references or personal experience. PQFP packaging information from Integrated Silicon Solution, Inc. https://en.wikipedia.org/w/index.php?title=Quad_flat_package&oldid=1140003139, This page was last edited on 17 February 2023, at 23:37. Metric Quad Flat Package. Package Size (mm) Lead Count LQFP 7 x 7 32, 48, 64 10 x 10 44, 64, 80 14 x 14 64, 80, 100, 120 20 x 20 144, 176 24 x 24 176 28 x 28 208 LQFP-ep 10 x 10 64 By definition, a QFP with 256 pins means that it would typically have around sixty-four pins protruding on either side of the package. Generally, large-scale or very large-scale integrated circuits use this In the form of packaging, the number . The LQFP is a leadframe based, plastic encapsulated package with gull wing shaped leads on four sides. The common ceramic flatpack packages are CFP (Ceramic Flat Pack) and QCFP (Quad Ceramic Flat Pack). Can I tell police to wait and call a lawyer when served with a search warrant? STM32F103 microcontrollers use the Cortex-M3 core, with a maximum CPU speed of 72 MHz. 505 Xinhua Road Xinhua District, Shijiazhuang Hebei China. Array carrier features quite large cost due to fine line circuits and chemical processing technology. LQFP package having total height less than 1.7mm (including 1.7mm) and more than 1.2mm (no including 1.2mm), said package named Low profile Quad Flat Package. TIs latest REACH statement is located on our Environmental information page. The heat dissipated by this IC needs to be ejected from them for better performance. The QFP component package type became common in Europe and United States during the early nineties, even though it has been used in Japanese consumer electronics since the seventies.